| Issue Date | Title | Author(s) |
| 2004 | Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devices | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
| 2006 | Fabrication of platinum membrane on silicon for MEMS microphone | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
| 2006 | Formation of thick spin-on glass (SOG) sacrificial layer for capacitive accelerometer encapsulation | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
| 2017 | Growth kinetic and composition of the interfacial layer for RF sputtering Al2O3 layer on germanium | Sahari, S.K. ; Kashif, M. ; Sutan, N.M. ; Embong, Z. ; Nik Zaini Fathi, N.A.F. ; Hamzah, A.A. ; Sapawi, R. ; Majlis, B.Y. ; Ahmad, I. |
| 2007 | HF etching of sacrificial spin-on glass in straight and junctioned microchannels for MEMS microstructure release | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
| 2006 | Modelling of sacrificial spin-on glass (SOG) etching in non-straight microchannels using hydrofluoric acid | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
| 2018 | Performance improvement for hybrid L-band remote erbium doped fiber amplifier/raman using phase modulator | Yusoff, N.M. ; Sulaiman, A.H. ; Ambran, S. ; Hamzah, A. ; Mahdi, M.A. |
| 2008 | Selection of high strength encapsulant for MEMS devices undergoing high-pressure packaging | Hamzah, A.A. ; Husaini, Y. ; Majlis, B.Y. ; Ahmad, I. |
| 2008 | Sputtered encapsulation as wafer level packaging for isolatable MEMS devices: A technique demonstrated on a capacitive accelerometer | Hamzah, A.A. ; Yunas, J. ; Majlis, B.Y. ; Ahmad, I. |
