Browsing by Author Amin, N.


Or, select a letter below to browse by last name
0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Showing results 1 to 20 of 39  next >
Issue DateTitleAuthor(s)
2008A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder systemLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb 
2008A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder systemLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 
2009A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packagesAmin, N. ; Lim, V. ; Seng, F.C. ; Razid, R. ; Ahmad, I. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2008A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder jointLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 
2008An efficient first order sigma delta modulator designAmin, N. ; Guan, G.C. ; Ahmad, I. 
2009BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloyLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Chiao, C.W. ; Haseeb, A.S.M.A. 
2008Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array packageLim, V. ; Ahmad, I. ; Seng, F.C. ; Amin, N. ; Rasid, R. 
2018Compositional disparity in Cu2ZnSnS4 (CZTS) thin film deposited by RF-sputtering from a single quaternary compound targetFerdaous, M.T. ; Chelvanathan, P. ; Shahahmadi, S.A. ; Sapeli, M.M.I. ; Sopian, K. ; Amin, N. 
2018Controllable formation of MoS2 via preferred crystallographic orientation modulation of DC-sputtered Mo thin filmChelvanathan, P. ; Shahahmadi, S.A. ; Ferdaous, M.T. ; Sapeli, M.M.I. ; Sopian, K. ; Amin, N. 
2018Cost effective thermoelectric composites from recycled carbon fibre: From waste to energyJagadish, P.R. ; Khalid, M. ; Li, L.P. ; Hajibeigy, M.T. ; Amin, N. ; Walvekar, R. ; Chan, A. 
2018Deposition and characterization of RF-sputtered-Ta2O5 thin films for O2 reduction reaction in polymer electrolyte membrane fuel cells (PEMFC)Samsudin, N. ; Ferdaous, M.T. ; Shahahmadi, S.A. ; Mustafa, S.N. ; Akhtaruzzaman, M. ; Sopian, K. ; Chelvanathan, P. ; Amin, N. 
2009Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvementLeng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A. 
2010Effect of plasma cleaning process in the wettability of flip chip PBGA substrate of integrated circuit packagesAmin, N. ; Cheah, A.Y. ; Ahmad, I. 
2008Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)Kornain, Z. ; Amin, N. ; Jalar, A. ; Cheah, A.Y. ; Ahmad, I. 
2018Effects of Cr doping in the structural and optoelectronic properties of Cu2ZnSnS4 (CZTS) thin film by magnetron co-sputteringSapeli, M.M.I. ; Ferdaous, M.T. ; Shahahmadi, S.A. ; Sopian, K. ; Chelvanathan, P. ; Amin, N. 
2011Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreaderLim, V. ; Amin, N. ; Foong, C.S. ; Ahmad, I. ; Zaharim, A. ; Rasid, R. ; Jalar, A. 
2018Effects of sulfurization temperature on structural, morphological, and optoelectronic properties of CTS thin films solar cellsHossain, E.S. ; Chelvanathan, P. ; Shahahmadi, S.A. ; Ferdaous, M.T. ; Bais, B. ; Tiong, S.K. ; Amin, N.