Browsing by Author Eu, P.-L.
Showing results 1 to 6 of 6
| Issue Date | Title | Author(s) |
|---|---|---|
| 2007 | A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finish | Eu, P.-L. ; Ding, M. ; Hoh, H.-J. ; Rayos, J. ; Su, P. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. |
| 2006 | Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance | Eu, P.L. ; Ding, M. ; Hoh, H.J. ; Ahmad, I. ; Hazlinda, K. |
| 2006 | Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength | Eu, P.-L. ; Ahmad, I. ; Jalar, A. ; Kamarudin, H. ; Majlis, B.Y. |
| 2007 | Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish | Eu, P.-L. ; Ding, M. ; Ahmad, I. |
| 2006 | Lead-free flux effect in lead-free solder joint improvement | Eu, P.L. ; Ding, M. ; Ahmad, I. ; Hoh, H.J. ; Hazlinda, K. |
| 2011 | Process optimization approach in fine pitch Cu wire bonding | Wong, B.K. ; Yong, C.C. ; Eu, P.L. ; Yap, B.K. |