Browsing by Author Ahmad, I.B.


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Issue DateTitleAuthor(s)
2011Statistical optimization for process parameters to reduce variability of 32 nm PMOS transistor threshold voltageElgomati, H.A. ; Majlis, B.Y. ; Ahmad, I. ; Salehuddin, F. ; Hamid, F.A. ; Zaharim, A. ; Mohamad, T.Z. ; Apte, P.R. 
2014Statistical process modelling for 32nm high-K/metal gate PMOS deviceMaheran, A.H.A. ; Noor Faizah, Z.A. ; Menon, P.S. ; Ahmad, I. ; Apte, P.R. ; Kalaivani, T. ; Salehuddin, F. 
2006Study of lifetime prediction of N-MOS transistor due to hot carrier effectAhmad, I. ; Kornain, Z. ; Idros, M.F.M. 
2014Study of the effect of WO3 and Bi2O3 on the microstructure and electrical properties of a TiO2 based varistorKothandapani, Z. ; Begum, S. ; Ahmad, I. ; Daud, I.R. ; Gholizadeh, S. 
2013Taguchi optimization of a SOI-based lateral PIN photodiode using SiGe/Si multilayer quantum wellMenon, P.S. ; Tasirin, S.K. ; Ahmad, I. ; Islam, S. ; Abdullah, S.F. 
2006TCAD simulation of local mechanical stress reduction by use of a compressive silicon nitride/silicon oxynitride etch stop bi-layer for CMOS performance enhancementAhmad, W.R.W. ; Kordesch, A.V. ; Ahmad, I. ; Chew, S.A. ; Yew, P.T.B. 
2006TCAD Simulation of STI stress effect on active length for 130nm technologyAhmad, W.R.W. ; Kordesch, A.V. ; Ahmad, I. ; Yew, P.T.B. 
2012Technique to improve visibility for cycle time improvement in semiconductor manufacturingRahim, S.R.A. ; Ahmad, I. ; Chik, M.A. 
2004Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)Kornain, Z. ; Ahmad, I. ; Omar, G. 
2007The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) depositionMd Arshad, M.K. ; Jalar, A. ; Ahmad, I. ; Omar, G. 
2006The characterization of KrF photoresists and the effect of different chromophore bulkiness on line edge roughness (LER) for submicron technologyYusri, A. ; Bakri, M. ; Manaf, M.J. ; Wahab, K.I.A. ; Ahmad, I.B. 
2008The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGAAmin, N. ; Cheah, A.Y. ; Kornain, Z. ; Ahmad, I. 
2007The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finishLeng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. 
2006The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packagingAbdullah, S.H. ; Ahmad, I. ; Jalar, A. 
2008The effect of surface texturing on GaAs solar cell using TCAD toolsJalil, S.M. ; Abdullah, L. ; Ahmad, I. ; Abdullah, H. 
2006The effects of high temperature storage on lead free solder joint material strength using pull test methodHarif, M.N. ; Ahmad, I. ; Zaharim, A. 
2006The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold depositionMd Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Hashim, U. 
2004The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) depositionMd Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
2006The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) depositionArshad, M.K.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
2018Threshold voltage and leakage current variability on process parameter in a 22nm PMOS DeviceAfifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Noor Faizah, Z.A. ; Mohd Zain, A.S. ; Salehuddin, F. ; Sayed, N.M.