Showing results 124 to 141 of 141
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| Issue Date | Title | Author(s) |
| 2006 | TCAD Simulation of STI stress effect on active length for 130nm technology | Ahmad, W.R.W. ; Kordesch, A.V. ; Ahmad, I. ; Yew, P.T.B. |
| 2012 | Technique to improve visibility for cycle time improvement in semiconductor manufacturing | Rahim, S.R.A. ; Ahmad, I. ; Chik, M.A. |
| 2004 | Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM) | Kornain, Z. ; Ahmad, I. ; Omar, G. |
| 2007 | The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) deposition | Md Arshad, M.K. ; Jalar, A. ; Ahmad, I. ; Omar, G. |
| 2006 | The characterization of KrF photoresists and the effect of different chromophore bulkiness on line edge roughness (LER) for submicron technology | Yusri, A. ; Bakri, M. ; Manaf, M.J. ; Wahab, K.I.A. ; Ahmad, I.B. |
| 2008 | The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA | Amin, N. ; Cheah, A.Y. ; Kornain, Z. ; Ahmad, I. |
| 2007 | The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish | Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. |
| 2006 | The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging | Abdullah, S.H. ; Ahmad, I. ; Jalar, A. |
| 2008 | The effect of surface texturing on GaAs solar cell using TCAD tools | Jalil, S.M. ; Abdullah, L. ; Ahmad, I. ; Abdullah, H. |
| 2006 | The effects of high temperature storage on lead free solder joint material strength using pull test method | Harif, M.N. ; Ahmad, I. ; Zaharim, A. |
| 2006 | The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold deposition | Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Hashim, U. |
| 2004 | The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition | Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2006 | The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition | Arshad, M.K.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2018 | Threshold voltage and leakage current variability on process parameter in a 22nm PMOS Device | Afifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Noor Faizah, Z.A. ; Mohd Zain, A.S. ; Salehuddin, F. ; Sayed, N.M. |
| 2013 | Threshold voltage optimization in a 22nm High-k/Salicide PMOS device | Afifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Yusoff, Z. |
| 2011 | Throughput improvement in semiconductor fabrication for 0.13μm technology | Balakrishna, P. ; Chik, M.A. ; Ahmad, I. ; Mohamad, B. |
| 2008 | Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology | Nor, N.H.M. ; Taib, S. ; Ahmad, I. ; Abdullah, H. |
| 2007 | Warpage and wire sweep analysis of QFN molded strip using experimental and modeling methods | Abdullah, I. ; Chiang, N.C. ; Mokhtar, U. ; Said, A. ; Talib, M.Z.M. ; Ahmad, I. |
