Showing results 24 to 43 of 141
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| Issue Date | Title | Author(s) |
| 2002 | Characterisation of polysilicon gate microstructures for 0.5 μm CMOS devices using transmission electron microscopy and atomic force microscopy images | Ahmad, I. ; Omar, A. ; Hussain, A. ; Mikdad, A. |
| 2010 | Characterization and optimizations of silicide thickness in 45nm pMOS device | Salehuddin, F. ; Ahmad, I. ; Hamid, F.A. ; Zaharim, A. |
| 2010 | Characterization of a submicron PMOS in mixer circuits | Yeap, K.H. ; Ahmad, I. ; Rizman, Z.I. ; Chew, K. ; Chong, K.H. ; Yong, Y.T. |
| 2010 | Characterization of fabrication process noises for 32nm NMOS devices | Elgomati, H.A. ; Majlis, B.Y. ; Ahmad, I. ; Ziad, T. |
| 2008 | Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package | Lim, V. ; Ahmad, I. ; Seng, F.C. ; Amin, N. ; Rasid, R. |
| 2007 | Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process | Md Arshad, M.K. ; Jalar, A. ; Ahmad, I. |
| 2011 | Cobalt silicide and titanium silicide effects on nano devices | Elgomati, H.A. ; Majlis, B.Y. ; Salehuddin, F. ; Ahmad, I. ; Zaharim, A. ; Hamid, F.A. |
| 2018 | Comparative Analysis of Process Parameter Variations in DGFinFET Device Using Statistical Methods | Roslan, A.F. ; Salehuddin, F. ; M Zain, A.S. ; Mansor, N. ; Kaharudin, K.E. ; Ahmad, I. ; Hazura, H. ; Hanim, A.R. ; Idris, S.K. ; Zaiton, A.M. ; Zarina, B.Z. ; Mohamad, N.R. ; A Hamid, A.M. |
| 2019 | Comparative high-K material gate spacer impact in DG-finfet parameter variations between two structures | Roslan, A.F. ; Salehuddin, F. ; Zain, A.S.M. ; Kaharudin, K.E. ; Ahmad, I. ; Hazura, H. ; Hanim, A.R. ; Idris, S.K. |
| 2004 | Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devices | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
| 2013 | Design and optimization of 22 nm gate length high-k/metal gate NMOS transistor | Afifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Shaari, S. ; Elgomati, H.A. ; Salehuddin, F. |
| 2012 | Design and optimization of 22nm NMOS transistor | Afifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Shaari, S. ; Elgomati, H.A. ; Majlis, B.Y. ; Salehuddin, F. |
| 2002 | Development of a simple in situ instrumentation for detection of breath alcohol and gas leak | Wagiran, R. ; Chong, A.G.E. ; Ahmad, I. ; Salleh, A.B. |
| 2007 | Dicing die attach film for 3D stacked die QFN packages | Abdullah, S. ; Mohd Yusof, S. ; Ahmad, I. ; Jalar, A. ; Daud, R. |
| 2008 | Dicing laminated wafer for QFN 3D stacked die packaging | Abdullah, S. ; Endut, Z. ; Ahmad, I. ; Jalar, A. ; Yusof, S.M. |
| 2009 | Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvement | Leng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A. |
| 2006 | Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2006 | Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging | Endut, Z. ; Ahmad, I. ; Zaharim, A. ; Sukemi, N.M. |
| 2010 | Effect of plasma cleaning process in the wettability of flip chip PBGA substrate of integrated circuit packages | Amin, N. ; Cheah, A.Y. ; Ahmad, I. |
| 2014 | Effect of process parameter variability on the threshold voltage of downscaled 22nm PMOS using taguchi method | Maheran, A.H.A. ; Menon, P.S. ; Shaari, S. ; Kalaivani, T. ; Ahmad, I. ; Faizah, Z.A.N. ; Apte, P.R. |
