Showing results 32 to 51 of 141
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| Issue Date | Title | Author(s) |
| 2019 | Comparative high-K material gate spacer impact in DG-finfet parameter variations between two structures | Roslan, A.F. ; Salehuddin, F. ; Zain, A.S.M. ; Kaharudin, K.E. ; Ahmad, I. ; Hazura, H. ; Hanim, A.R. ; Idris, S.K. |
| 2004 | Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devices | Hamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. |
| 2013 | Design and optimization of 22 nm gate length high-k/metal gate NMOS transistor | Afifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Shaari, S. ; Elgomati, H.A. ; Salehuddin, F. |
| 2012 | Design and optimization of 22nm NMOS transistor | Afifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Shaari, S. ; Elgomati, H.A. ; Majlis, B.Y. ; Salehuddin, F. |
| 2002 | Development of a simple in situ instrumentation for detection of breath alcohol and gas leak | Wagiran, R. ; Chong, A.G.E. ; Ahmad, I. ; Salleh, A.B. |
| 2007 | Dicing die attach film for 3D stacked die QFN packages | Abdullah, S. ; Mohd Yusof, S. ; Ahmad, I. ; Jalar, A. ; Daud, R. |
| 2008 | Dicing laminated wafer for QFN 3D stacked die packaging | Abdullah, S. ; Endut, Z. ; Ahmad, I. ; Jalar, A. ; Yusof, S.M. |
| 2009 | Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvement | Leng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A. |
| 2006 | Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2006 | Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging | Endut, Z. ; Ahmad, I. ; Zaharim, A. ; Sukemi, N.M. |
| 2010 | Effect of plasma cleaning process in the wettability of flip chip PBGA substrate of integrated circuit packages | Amin, N. ; Cheah, A.Y. ; Ahmad, I. |
| 2014 | Effect of process parameter variability on the threshold voltage of downscaled 22nm PMOS using taguchi method | Maheran, A.H.A. ; Menon, P.S. ; Shaari, S. ; Kalaivani, T. ; Ahmad, I. ; Faizah, Z.A.N. ; Apte, P.R. |
| 2010 | Effect of process parameter variations on threshold voltage in 45nm NMOS device | Salehuddin, F. ; Ahmad, I. ; Hamid, F.A. ; Zaharim, A. |
| 2006 | Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength | Eu, P.-L. ; Ahmad, I. ; Jalar, A. ; Kamarudin, H. ; Majlis, B.Y. |
| 2011 | Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates | Muhammad, N.A. ; Bais, B.H. ; Ahmad, I. ; Isnin, A. |
| 2008 | Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA) | Kornain, Z. ; Amin, N. ; Jalar, A. ; Cheah, A.Y. ; Ahmad, I. |
| 2006 | Effect of wafer thinning methods towards fracture strength and topography of silicon die | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2011 | Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreader | Lim, V. ; Amin, N. ; Foong, C.S. ; Ahmad, I. ; Zaharim, A. ; Rasid, R. ; Jalar, A. |
| 2014 | Effects of high-K dielectrics with metal gate for electrical characteristics of 18nm NMOS device | Atan, N.B. ; Ahmad, I.B. ; Majlis, B.B.Y. |
| 2000 | Electrical and microstructures properties of polygate electrode in 0.5 μm CMOS devices | Omar, A. ; Ahmad, I. ; Alias, A.J. |
