Showing results 98 to 117 of 141
< previous
next >
| Issue Date | Title | Author(s) |
| 2002 | Pass transistor logic ALU design | Wagiran, R. ; Chong, A.B. ; Ahmad, I. |
| 2007 | Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finish | Leng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A. |
| 2006 | Performances test statistics for single outlier detection in bilinear (1,1,1,1) models | Zaharim, A. ; Mohamed, I. ; Ahmad, I. ; Abdullah, S. ; Omar, M.Z. |
| 2016 | Process Parameters Optimization of 14nm MOSFET Using 2-D Analytical Modelling | Noor Faizah, Z.A. ; Ahmad, I. ; Ker, P.J. ; Siti Munirah, Y. ; Mohd Firdaus, R. ; Md Fazle, E. ; Menon, P.S. |
| 2006 | Pulse power failure model of power MOSFET due to electrical overstress using tasca method | Ismail, N.S. ; Ahmad, I. ; Husain, H. ; Chuah, S. |
| 2008 | Reduction of warpage occurrence on stack-die QFN using FEA and statistical method | Abdullah, I. ; Ahmad, I. ; Talib, M.Z.M. ; Kamarudin, M.N.B.C. |
| 2014 | Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system | Adhila Muhammad, N. ; Bais, B. ; Ahmad, I. |
| 2013 | Responsivity optimization of a MQW SOI-based lateral PIN photodiode using Taguchi's L27 orthogonal array | Menon, P.S. ; Tasirin, S.K. ; Ahmad, I. ; Abdullah, S.F. ; Apte, P.R. |
| 2000 | Review on policies, research & development in microelectronic industry in Malaysia | Ahmad, I.B. ; Sulaiman, N.B. |
| 2012 | Robust optimization of a silicon lateral pin photodiode | Kalthom Tasirin, S. ; Susthitha Menon, P. ; Ahmad, I. ; Fazlili Abdullah, S. |
| 2012 | Scaling down of the 32 nm to 22 nm gate length NMOS transistor | Afifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Elgomati, H.A. ; Majlis, B.Y. ; Salehuddin, F. |
| 2008 | Selection of high strength encapsulant for MEMS devices undergoing high-pressure packaging | Hamzah, A.A. ; Husaini, Y. ; Majlis, B.Y. ; Ahmad, I. |
| 2009 | Simulation of fabrication process VDMOSFET transistor using Silvaco software | Abdullah, H. ; Jurait, J. ; Lennie, A. ; Nopiah, Z.M. ; Ahmad, I. |
| 2006 | Solder bump strength and failure mode of low-k flip chip device | Endut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. |
| 2006 | Solder joint strength of lead free solders under multiple reflow and high temperature storage condition | Ahmad, I. ; Jalar, A. ; Majlis, B.Y. ; Leng, E.P. ; San, Y.S. |
| 2004 | Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top | Salleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Abdullah, S.H. ; Arshad, M.K. |
| 2008 | Sputtered encapsulation as wafer level packaging for isolatable MEMS devices: A technique demonstrated on a capacitive accelerometer | Hamzah, A.A. ; Yunas, J. ; Majlis, B.Y. ; Ahmad, I. |
| 2009 | Statistical design of ultra-thin SiO2 for nanodevices | Hashim, U. ; Abdul Fatah, M.F.A. ; Ahmad, I. ; Majlis, B.Y. |
| 2012 | Statistical modeling of solar cell using Taguchi method and TCAD tool | Bahrudin, M.S. ; Abdullah, S.F. ; Ahmad, I. |
| 2016 | Statistical modelling of 14nm n-types MOSFET | Noor Faizah, Z.A. ; Ahmad, I. ; Ker, P.J. ; Siti Munirah, Y. ; Mohd Firdaus, R. ; Mah, S.K. ; Menon, P.S. |
