Showing results 8 to 24 of 24
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Issue Date | Title | Author(s) |
2006 | Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
2006 | Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength | Eu, P.-L. ; Ahmad, I. ; Jalar, A. ; Kamarudin, H. ; Majlis, B.Y. |
2008 | Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA) | Kornain, Z. ; Amin, N. ; Jalar, A. ; Cheah, A.Y. ; Ahmad, I. |
2006 | Effect of wafer thinning methods towards fracture strength and topography of silicon die | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
2011 | Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreader | Lim, V. ; Amin, N. ; Foong, C.S. ; Ahmad, I. ; Zaharim, A. ; Rasid, R. ; Jalar, A. |
2005 | Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump | Salleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
2012 | Morphology and optical properties of nickel oxide nanostructure from aqueous solution | Hamid, M.A.A. ; Bakar, M.A. ; Jalar, A. ; Shamsudin, R. ; Ahmad, I. |
2007 | Optimization of nickel thickness on substrate for TBGA using SAC387 solder material | Ahmad, I. ; Majlis, B.Y. ; Jalar, A. ; Leng, E.P. |
2007 | Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finish | Leng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A. |
2006 | Solder joint strength of lead free solders under multiple reflow and high temperature storage condition | Ahmad, I. ; Jalar, A. ; Majlis, B.Y. ; Leng, E.P. ; San, Y.S. |
2004 | Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top | Salleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Abdullah, S.H. ; Arshad, M.K. |
2007 | The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) deposition | Md Arshad, M.K. ; Jalar, A. ; Ahmad, I. ; Omar, G. |
2007 | The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish | Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. |
2006 | The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging | Abdullah, S.H. ; Ahmad, I. ; Jalar, A. |
2006 | The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold deposition | Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Hashim, U. |
2004 | The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition | Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
2006 | The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition | Arshad, M.K.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. |