Showing results 3 to 22 of 39
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| Issue Date | Title | Author(s) |
| 2009 | A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages | Amin, N. ; Lim, V. ; Seng, F.C. ; Razid, R. ; Ahmad, I. |
| 2008 | A study of lead-free BGA backward compatibility through solderability testing at component level | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. |
| 2008 | A study of lead-free BGA backward compatibility through solderability testing at component level | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. |
| 2008 | A study of lead-free BGA backward compatibility through solderability testing at component level | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. |
| 2008 | A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder joint | Leng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. |
| 2008 | An efficient first order sigma delta modulator design | Amin, N. ; Guan, G.C. ; Ahmad, I. |
| 2009 | BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Chiao, C.W. ; Haseeb, A.S.M.A. |
| 2008 | Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package | Lim, V. ; Ahmad, I. ; Seng, F.C. ; Amin, N. ; Rasid, R. |
| 2018 | Compositional disparity in Cu2ZnSnS4 (CZTS) thin film deposited by RF-sputtering from a single quaternary compound target | Ferdaous, M.T. ; Chelvanathan, P. ; Shahahmadi, S.A. ; Sapeli, M.M.I. ; Sopian, K. ; Amin, N. |
| 2018 | Controllable formation of MoS2 via preferred crystallographic orientation modulation of DC-sputtered Mo thin film | Chelvanathan, P. ; Shahahmadi, S.A. ; Ferdaous, M.T. ; Sapeli, M.M.I. ; Sopian, K. ; Amin, N. |
| 2018 | Cost effective thermoelectric composites from recycled carbon fibre: From waste to energy | Jagadish, P.R. ; Khalid, M. ; Li, L.P. ; Hajibeigy, M.T. ; Amin, N. ; Walvekar, R. ; Chan, A. |
| 2018 | Deposition and characterization of RF-sputtered-Ta2O5 thin films for O2 reduction reaction in polymer electrolyte membrane fuel cells (PEMFC) | Samsudin, N. ; Ferdaous, M.T. ; Shahahmadi, S.A. ; Mustafa, S.N. ; Akhtaruzzaman, M. ; Sopian, K. ; Chelvanathan, P. ; Amin, N. |
| 2009 | Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvement | Leng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A. |
| 2010 | Effect of plasma cleaning process in the wettability of flip chip PBGA substrate of integrated circuit packages | Amin, N. ; Cheah, A.Y. ; Ahmad, I. |
| 2008 | Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA) | Kornain, Z. ; Amin, N. ; Jalar, A. ; Cheah, A.Y. ; Ahmad, I. |
| 2018 | Effects of Cr doping in the structural and optoelectronic properties of Cu2ZnSnS4 (CZTS) thin film by magnetron co-sputtering | Sapeli, M.M.I. ; Ferdaous, M.T. ; Shahahmadi, S.A. ; Sopian, K. ; Chelvanathan, P. ; Amin, N. |
| 2011 | Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreader | Lim, V. ; Amin, N. ; Foong, C.S. ; Ahmad, I. ; Zaharim, A. ; Rasid, R. ; Jalar, A. |
| 2018 | Effects of sulfurization temperature on structural, morphological, and optoelectronic properties of CTS thin films solar cells | Hossain, E.S. ; Chelvanathan, P. ; Shahahmadi, S.A. ; Ferdaous, M.T. ; Bais, B. ; Tiong, S.K. ; Amin, N. |
| 2018 | Fabrication techniques and morphological analysis of perovskite absorber layer for high-efficiency perovskite solar cell: A review | Jamal, M.S. ; Bashar, M.S. ; Hasan, A.K.M. ; Almutairi, Z.A. ; Alharbi, H.F. ; Alharthi, N.H. ; Karim, M.R. ; Misran, H. ; Amin, N. ; Sopian, K.B. ; Akhtaruzzaman, M. |
| 2008 | FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. |
