Browsing by Author Ling, W.T.
Showing results 5 to 7 of 7
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| Issue Date | Title | Author(s) |
|---|---|---|
| 2009 | Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvement | Leng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A. |
| 2008 | FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. |
| 2008 | Lead-free solder ball attach improvement on FCPBGA with SOP pad finishing | Ling, W.T. ; Leng, E.P. ; Amin, N. ; Ahmad, I. |