Showing results 8 to 16 of 16
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| Issue Date | Title | Author(s) |
| 2009 | Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvement | Leng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A. |
| 2008 | FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. |
| 2011 | Improvement of Cu-Al bond integrity on low k pad structures | Kid, W.B. ; Leng, E.P. ; Yong, C.C. ; Yi, O.X. ; Kar, Y.B. |
| 2008 | Lead-free solder ball attach improvement on FCPBGA with SOP pad finishing | Ling, W.T. ; Leng, E.P. ; Amin, N. ; Ahmad, I. |
| 2011 | Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire | Kid, W.B. ; Leng, E.P. ; Seong, L.B. ; Weily, C. ; Kar, Y.B. |
| 2007 | Optimization of nickel thickness on substrate for TBGA using SAC387 solder material | Ahmad, I. ; Majlis, B.Y. ; Jalar, A. ; Leng, E.P. |
| 2007 | Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finish | Leng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A. |
| 2006 | Solder joint strength of lead free solders under multiple reflow and high temperature storage condition | Ahmad, I. ; Jalar, A. ; Majlis, B.Y. ; Leng, E.P. ; San, Y.S. |
| 2007 | The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish | Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. |
