Jalar, A.

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Author: Abdullah, S.

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	Issue Date	Title	Author(s)
1	2008	Dicing laminated wafer for QFN 3D stacked die packaging	Abdullah, S. ; Endut, Z. ; Ahmad, I. ; Jalar, A. ; Yusof, S.M.
2	2007	Dicing die attach film for 3D stacked die QFN packages	Abdullah, S. ; Mohd Yusof, S. ; Ahmad, I. ; Jalar, A. ; Daud, R.

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Jalar, A.

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