Isnin, A.
Publications
(Others)
Results 1-3 of 3 (Search time: 0.0 seconds).
Issue Date | Title | Author(s) | |
---|---|---|---|
1 | 2011 | Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging | Shualdi, W. ; Bais, B. ; Ahmad, I. ; Omar, G. ; Isnin, A. |
2 | 2008 | Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging | Shualdi, W. ; Ahmad, I. ; Omar, G. ; Isnin, A. |
3 | 2011 | Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates | Muhammad, N.A. ; Bais, B.H. ; Ahmad, I. ; Isnin, A. |
Loading...
2
0
5
0
false
Full Name
Isnin, A.
Loading...
3
0
5
0
false