Leng, E.P.
Results 1-3 of 3 (Search time: 0.0 seconds).
Issue Date | Title | Author(s) | |
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1 | 2006 | Solder joint strength of lead free solders under multiple reflow and high temperature storage condition | Ahmad, I. ; Jalar, A. ; Majlis, B.Y. ; Leng, E.P. ; San, Y.S. |
2 | 2007 | Optimization of nickel thickness on substrate for TBGA using SAC387 solder material | Ahmad, I. ; Majlis, B.Y. ; Jalar, A. ; Leng, E.P. |
3 | 2006 | A study on inter-metallic compound formation and structure of lead free SnAgCu solder system | Ahmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R. |
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Full Name
Leng, E.P.
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