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Leng, E.P.

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Author:  Ahmad, I.

Results 1-13 of 13 (Search time: 0.0 seconds).

Issue DateTitleAuthor(s)
12007The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finishLeng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. 
22006Solder joint strength of lead free solders under multiple reflow and high temperature storage conditionAhmad, I. ; Jalar, A. ; Majlis, B.Y. ; Leng, E.P. ; San, Y.S. 
32007Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finishLeng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A. 
42007Optimization of nickel thickness on substrate for TBGA using SAC387 solder materialAhmad, I. ; Majlis, B.Y. ; Jalar, A. ; Leng, E.P. 
52008Lead-free solder ball attach improvement on FCPBGA with SOP pad finishingLing, W.T. ; Leng, E.P. ; Amin, N. ; Ahmad, I. 
62008FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvementLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
72009Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvementLeng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A. 
82009BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloyLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Chiao, C.W. ; Haseeb, A.S.M.A. 
92006A study on inter-metallic compound formation and structure of lead free SnAgCu solder systemAhmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R. 
102008A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder jointLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 
112007A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finishLeng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. 
122008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
132007A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finishLeng, E.P. ; Ding, M. ; Ahmad, I. ; Jalar, A. 

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Leng, E.P.
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