Ding, M.
Results 1-4 of 4 (Search time: 0.0 seconds).
Issue Date | Title | Author(s) | |
---|---|---|---|
1 | 2007 | The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish | Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. |
2 | 2007 | Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finish | Leng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A. |
3 | 2007 | A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish | Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. |
4 | 2007 | A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finish | Leng, E.P. ; Ding, M. ; Ahmad, I. ; Jalar, A. |
Loading...
2
0
5
0
false
Full Name
Ding, M.
Loading...
3
0
5
0
false