Seng, F.C.
Publications
(Others)
Results 1-4 of 4 (Search time: 0.0 seconds).
| Issue Date | Title | Author(s) | |
|---|---|---|---|
| 1 | 2013 | Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology | Kar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Seng, F.C. ; Yong, T.C. ; Retnasamy, V. |
| 2 | 2012 | Flux residue cleaning process optimization effect on Flip Chip Ball Grid Array reliability | Kar, Y.B. ; Tahk, N.A. ; Seng, F.C. ; Yang, L.H. ; Vithyacharan, R. ; Yong, T.C. |
| 3 | 2008 | Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package | Lim, V. ; Ahmad, I. ; Seng, F.C. ; Amin, N. ; Rasid, R. |
| 4 | 2009 | A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages | Amin, N. ; Lim, V. ; Seng, F.C. ; Razid, R. ; Ahmad, I. |
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Full Name
Seng, F.C.
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