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Author:  Yong, T.C.

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Issue DateTitleAuthor(s)
12013Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technologyKar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Seng, F.C. ; Yong, T.C. ; Retnasamy, V. 
22012Flux residue cleaning process optimization effect on Flip Chip Ball Grid Array reliabilityKar, Y.B. ; Tahk, N.A. ; Seng, F.C. ; Yang, L.H. ; Vithyacharan, R. ; Yong, T.C. 

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Full Name
Seng, F.C.
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