Kornain, Z.

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2 2008
1 2006
1 2004

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	Issue Date	Title	Author(s)
1	2008	The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA	Amin, N. ; Cheah, A.Y. ; Kornain, Z. ; Ahmad, I.
2	2004	Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)	Kornain, Z. ; Ahmad, I. ; Omar, G.
3	2006	Study of lifetime prediction of N-MOS transistor due to hot carrier effect	Ahmad, I. ; Kornain, Z. ; Idros, M.F.M.
4	2008	Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)	Kornain, Z. ; Amin, N. ; Jalar, A. ; Cheah, A.Y. ; Ahmad, I.

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Kornain, Z.

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