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Author:  Jalar, A.

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Issue DateTitleAuthor(s)
12007Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finishLeng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A. 

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Lindsay, W.
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