Chopin, S.

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	Issue Date	Title	Author(s)
1	2007	Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finish	Leng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A.
2	2007	A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finish	Eu, P.-L. ; Ding, M. ; Hoh, H.-J. ; Rayos, J. ; Su, P. ; Lindsay, W. ; Chopin, S. ; Ahmad, I.

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Chopin, S.

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