Jiun, H.H.
Publications
(Others)
Results 1-4 of 4 (Search time: 0.0 seconds).
| Issue Date | Title | Author(s) | |
|---|---|---|---|
| 1 | 2006 | Effect of wafer thinning methods towards fracture strength and topography of silicon die | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2 | 2006 | Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 3 | 2004 | Alternative double pass dicing method for thin wafer laminated with die attach film | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 4 | 2006 | A study on inter-metallic compound formation and structure of lead free SnAgCu solder system | Ahmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R. |
Loading...
2
0
5
0
false
Full Name
Jiun, H.H.
Loading...
3
0
5
0
false