Jiun, H.H.
Publications
(Others)
Results 1-3 of 3 (Search time: 0.0 seconds).
Issue Date | Title | Author(s) | |
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1 | 2006 | Effect of wafer thinning methods towards fracture strength and topography of silicon die | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
2 | 2006 | Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
3 | 2004 | Alternative double pass dicing method for thin wafer laminated with die attach film | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
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Full Name
Jiun, H.H.
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