Jiun, H.H.
Publications
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| Issue Date | Title | Author(s) | |
|---|---|---|---|
| 1 | 2006 | A study on inter-metallic compound formation and structure of lead free SnAgCu solder system | Ahmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R. |
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Full Name
Jiun, H.H.
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