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Issue DateTitleAuthor(s)
12011Process optimization approach in fine pitch Cu wire bondingWong, B.K. ; Yong, C.C. ; Eu, P.L. ; Yap, B.K. 
22011Improvement of Cu-Al bond integrity on low k pad structuresKid, W.B. ; Leng, E.P. ; Yong, C.C. ; Yi, O.X. ; Kar, Y.B. 

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Yong, C.C.
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