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|Title:||A study on lead free SnAgCu solder system||Authors:||Hoh, H.J.
|Issue Date:||2006||Abstract:||This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and Differential Scanning Calorimetry (DSC) respectively. Overall results indicates that Sn3.8Ag0.7Cu having the most favorable results with highest shear strength, narrow melting peak and low surface oxidation. Further works done to understand in depth of the microstructure and elemental properties reveals that Sn3.8Ag0.7Cu has dendritic microstructure with Ag-Sn plate and Cu-Ni-Sn IMC interface.||URI:||http://dspace.uniten.edu.my:80/jspui/handle/123456789/5298|
|Appears in Collections:||COE Scholarly Publication|
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