Browsing by Author Ahmad, I.B.


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Issue DateTitleAuthor(s)
2007A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finishEu, P.-L. ; Ding, M. ; Hoh, H.-J. ; Rayos, J. ; Su, P. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. 
2007A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finishLeng, E.P. ; Ding, M. ; Ahmad, I. ; Jalar, A. 
2008A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder systemLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb 
2008A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder systemLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 
2009A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packagesAmin, N. ; Lim, V. ; Seng, F.C. ; Razid, R. ; Ahmad, I. 
2004A simulation approach for dispatching techniques comparison in 200mm wafer foundryChik, M.A. ; Ahmad, I. ; Jamaluddin, Md.Y. 
2010A study for optimum productivity yield in 0.16μm mixed of wafer fabrication facilityChik, M.A. ; Yung, V.C. ; Balakrishna, P. ; Hashim, U. ; Ahmad, I. ; Mohamad, B. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2007A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finishLeng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. 
2008A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder jointLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 
2006A study on inter-metallic compound formation and structure of lead free SnAgCu solder systemAhmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R. 
2006A study on lead free SnAgCu solder systemHoh, H.J. ; Eu, P.L. ; Ding, M. ; Ahmad, I. 
2006Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performanceEu, P.L. ; Ding, M. ; Hoh, H.J. ; Ahmad, I. ; Hazlinda, K. 
2004Alternative double pass dicing method for thin wafer laminated with die attach filmJiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
2004An alternative approach to measures the application of dispatching rule in the wafer foundryChik, M.A. ; Ahmad, I. ; Jamaluddin, Md.Y. 
2004An alternative doping technique of polysilicon gate for sub-micron CMOS/BiCMOS devicesOmar, A. ; Kamariah, S. ; Ahmad, I. 
2008An efficient first order sigma delta modulator designAmin, N. ; Guan, G.C. ; Ahmad, I. 
2008An experimental study of defect determination using pulsed thermal non-destructive testingUmar, M.Z. ; Ahmad, I. ; Hamzah, A.R. ; Abdullah, W.S.W.