| Issue Date | Title | Author(s) |
| 2004 | Alternative double pass dicing method for thin wafer laminated with die attach film | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2006 | Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2006 | Effect of wafer thinning methods towards fracture strength and topography of silicon die | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2008 | Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging | Shualdi, W. ; Ahmad, I. ; Omar, G. ; Isnin, A. |
| 2005 | Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump | Salleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2011 | Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging | Shualdi, W. ; Bais, B. ; Ahmad, I. ; Omar, G. ; Isnin, A. |
| 2004 | Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top | Salleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Abdullah, S.H. ; Arshad, M.K. |
| 2004 | Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM) | Kornain, Z. ; Ahmad, I. ; Omar, G. |
| 2007 | The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) deposition | Md Arshad, M.K. ; Jalar, A. ; Ahmad, I. ; Omar, G. |
| 2006 | The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold deposition | Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Hashim, U. |
| 2004 | The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition | Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2006 | The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition | Arshad, M.K.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
