Browsing by Author Ling, W.T.

Showing results 1 to 11 of 11
Issue DateTitleAuthor(s)
2008A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder systemLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb 
2008A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder systemLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2008A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder jointLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 
2009BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloyLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Chiao, C.W. ; Haseeb, A.S.M.A. 
2009Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvementLeng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A. 
2008FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvementLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2008Lead-free solder ball attach improvement on FCPBGA with SOP pad finishingLing, W.T. ; Leng, E.P. ; Amin, N. ; Ahmad, I. 
2008Lead-free solder ball attach improvement on FCPBGA with SOP pad finishingLing, W.T. ; Leng, E.P. ; Amin, N. ; Ahmad, I.