Browsing by Author Leng, E.P.

Showing results 1 to 20 of 20
Issue DateTitleAuthor(s)
2007A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finishLeng, E.P. ; Ding, M. ; Ahmad, I. ; Jalar, A. 
2008A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder systemLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb 
2008A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder systemLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2007A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finishLeng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. 
2008A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder jointLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 
2006A study on inter-metallic compound formation and structure of lead free SnAgCu solder systemAhmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R. 
2009BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloyLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Chiao, C.W. ; Haseeb, A.S.M.A. 
2009Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvementLeng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A. 
2008FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvementLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2011Improvement of Cu-Al bond integrity on low k pad structuresKid, W.B. ; Leng, E.P. ; Yong, C.C. ; Yi, O.X. ; Kar, Y.B. 
2008Lead-free solder ball attach improvement on FCPBGA with SOP pad finishingLing, W.T. ; Leng, E.P. ; Amin, N. ; Ahmad, I. 
2008Lead-free solder ball attach improvement on FCPBGA with SOP pad finishingLing, W.T. ; Leng, E.P. ; Amin, N. ; Ahmad, I. 
2011Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wireKid, W.B. ; Leng, E.P. ; Seong, L.B. ; Weily, C. ; Kar, Y.B. 
2007Optimization of nickel thickness on substrate for TBGA using SAC387 solder materialAhmad, I. ; Majlis, B.Y. ; Jalar, A. ; Leng, E.P. 
2007Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finishLeng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A. 
2006Solder joint strength of lead free solders under multiple reflow and high temperature storage conditionAhmad, I. ; Jalar, A. ; Majlis, B.Y. ; Leng, E.P. ; San, Y.S. 
2007The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finishLeng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C.