| Issue Date | Title | Author(s) |
| 2018 | Calculating customer experience management index for telecommunication service using genetic algorithm based weighted attributes | Khan, N. ; Akram, M.U. ; Shah, A. ; Khan, S.A. |
| 2014 | Characterisation of insulated Cu wire ball bonding | Leong, H.Y. ; Yap, B.K. ; Khan, N. ; Ibrahim, M.R. ; Tan, L.C. ; Faiz, M. |
| 2012 | Development of insulated Cu wire ball bonding | Leong, H.Y. ; Mohd, F.Z. ; Ibrahim, M.R. ; Kid, W.B. ; Khan, N. ; Kar, Y.B. ; Tan, L.C. |
| 2011 | Effect of Ge4+ and Mg2+ doping on superconductivity, fluctuation induced conductivity and interplanar coupling of TlSr 2CaCu2O7-δ superconductors | Ali Yusuf, A. ; Yahya, A.K. ; Khan, N.A. ; Salleh, F.M. ; Marsom, E. ; Huda, N. |
| 2019 | Effects of growth temperatures on the structural and optoelectronic properties of sputtered zinc sulfide thin films for solar cell applications | Haque, F. ; Rahman, K.S. ; Islam, M.A. ; Yusoff, Y. ; Khan, N.A. ; Nasser, A.A. ; Amin, N. |
| 2014 | Insulated Cu wire free air ball characterization | Leong, H. ; Yap, B. ; Khan, N. ; Ibrahim, M.R. ; Tan, L.C. |
| 2014 | Manufacturability readiness of insulated Cu wire bonding process in PBGA package | Hungyang, L. ; Boonkar, Y. ; Yong, T.C. ; Khan, N. ; Ibrahim, M.R. ; Tan, L.C. |
| 2014 | Stitch bond strength study in insulated Cu wire bonding | Leong, H.Y. ; Yap, B.K. ; Khan, N. ; Ibrahim, M.R. ; Tan, L.C. ; Faiz, M. |
