Browsing by Author Retnasamy, V.

Showing results 1 to 2 of 2
Issue DateTitleAuthor(s)
2013Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUSKar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Fei, J.S. ; Retnasamy, V. 
2013Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technologyKar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Seng, F.C. ; Yong, T.C. ; Retnasamy, V.