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Browsing by Author Endut, Z.
Showing results 1 to 4 of 4
| Issue Date | Title | Author(s) |
|---|---|---|
| 2008 | Dicing laminated wafer for QFN 3D stacked die packaging | Abdullah, S. ; Endut, Z. ; Ahmad, I. ; Jalar, A. ; Yusof, S.M. |
| 2006 | Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging | Endut, Z. ; Ahmad, I. ; Zaharim, A. ; Sukemi, N.M. |
| 2006 | Impact of low-k devices on failure mode of flip chip tensile pull test | Endut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. |
| 2006 | Solder bump strength and failure mode of low-k flip chip device | Endut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. |