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Issue Date	Title	Author(s)
2008	Selection of high strength encapsulant for MEMS devices undergoing high-pressure packaging	Hamzah, A.A. ; Husaini, Y. ; Majlis, B.Y. ; Ahmad, I.
2008	Sputtered encapsulation as wafer level packaging for isolatable MEMS devices: A technique demonstrated on a capacitive accelerometer	Hamzah, A.A. ; Yunas, J. ; Majlis, B.Y. ; Ahmad, I.

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