Browsing by Author Ahmad, I.B.


Or, select a letter below to browse by last name
0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Showing results 62 to 81 of 145 < previous   next >
Issue DateTitleAuthor(s)
2013High performance silicon lateral PIN photodiodeTasirin, S.K. ; Menon, P.S. ; Ahmad, I. ; Abdullah, S.F. 
2018High-k Dielectric Thickness and Halo Implant on Threshold Voltage ControlMah, S.K. ; Ahmad, I. ; Ker, P.J. ; Noor Faizah, Z.A. 
2012Impact of different dose and angle in HALO structure for 45nm NMOS deviceSalehuddin, F. ; Ahmad, I. ; Hamid, F.A. ; Zaharim, A. 
2010Impact of HALO structure on threshold voltage and leakage current in 45nm NMOS deviceSalehuddin, F. ; Ahmad, I. ; Hamid, F.A. ; Zaharim, A. 
2006Impact of low-k devices on failure mode of flip chip tensile pull testEndut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. 
2008Improved series resistance model for CMOS ESD diodesKamal, N.B. ; Kordesch, A.V. ; Ahmad, I.B. 
2011Influence of HALO and source/drain implantation on threshold voltage in 45nm PMOS deviceSalehuddin, F. ; Ahmad, I. ; Hamid, F.A. ; Zaharim, A. 
2015Influence of process parameters on threshold voltage and leakage current in 18nm NMOS deviceAtan, N.B. ; Ahmad, I.B. ; Majlis, B.B.Y. ; Fauzi, I.B.A. 
2008Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal agingShualdi, W. ; Ahmad, I. ; Omar, G. ; Isnin, A. 
2007Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au FinishEu, P.-L. ; Ding, M. ; Ahmad, I. 
2018Jsc and Voc optimization of perovskite solar cell with interface defect layer using taguchi methodBahrudin, M.S. ; Abdullah, S.F. ; Ahmad, I. ; Zuhdi, A.W.M. ; Hasani, A.H. ; Za'Abar, F. ; Malik, M. ; Harif, M.N. 
2018Jsc and Voc optimization of perovskite solar cell with interface defect layer using taguchi methodBahrudin, M.S. ; Abdullah, S.F. ; Ahmad, I. ; Zuhdi, A.W.M. ; Hasani, A.H. ; Za'Abar, F. ; Malik, M. ; Harif, M.N. 
2006Lead-free flux effect in lead-free solder joint improvementEu, P.L. ; Ding, M. ; Ahmad, I. ; Hoh, H.J. ; Hazlinda, K. 
2008Lead-free solder ball attach improvement on FCPBGA with SOP pad finishingLing, W.T. ; Leng, E.P. ; Amin, N. ; Ahmad, I. 
2008Lead-free solder ball attach improvement on FCPBGA with SOP pad finishingLing, W.T. ; Leng, E.P. ; Amin, N. ; Ahmad, I. 
2002MATLAB based image analysis software for characterization of microstructure materialsHussain, A. ; Muad, A.M. ; Ahmad, I. ; Azhari, C.H. 
2010Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal conditionHarif, M.N. ; Ahmad, I. 
2018Mediating role of E- learning resources in developing entrepreneurial inclinations amongst undergraduate students at Universiti Utara MalaysiaRamli, A. ; Shabbir, M.S. ; Bakar, M.S.B. ; Shariff, M.N.M. ; Yusof, M.S. ; Ahmad, I. 
2011Message from chair of ED chapter, IEEE Malaysia section (Co-Chair RSM 2011)Ahmad, I. 
2005Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bumpSalleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G.