Browsing by Author Jalar, A.
Showing results 21 to 24 of 24
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Issue Date | Title | Author(s) |
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2006 | The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging | Abdullah, S.H. ; Ahmad, I. ; Jalar, A. |
2006 | The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold deposition | Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Hashim, U. |
2004 | The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition | Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
2006 | The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition | Arshad, M.K.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. |