Browsing by Author Isnin, A.
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Issue Date | Title | Author(s) |
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2008 | Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging | Shualdi, W. ; Ahmad, I. ; Omar, G. ; Isnin, A. |
2011 | Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging | Shualdi, W. ; Bais, B. ; Ahmad, I. ; Omar, G. ; Isnin, A. |