Showing results 7 to 12 of 12
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| Issue Date | Title | Author(s) |
| 2004 | Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top | Salleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Abdullah, S.H. ; Arshad, M.K. |
| 2004 | Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM) | Kornain, Z. ; Ahmad, I. ; Omar, G. |
| 2007 | The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) deposition | Md Arshad, M.K. ; Jalar, A. ; Ahmad, I. ; Omar, G. |
| 2006 | The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold deposition | Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Hashim, U. |
| 2004 | The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition | Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2006 | The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition | Arshad, M.K.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
