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Browsing by Author Haseeb, A.S.M.A.
Showing results 1 to 4 of 4
| Issue Date | Title | Author(s) |
|---|---|---|
| 2008 | A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder system | Leng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. |
| 2008 | A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder joint | Leng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. |
| 2009 | BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Chiao, C.W. ; Haseeb, A.S.M.A. |
| 2009 | Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvement | Leng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A. |