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Issue Date	Title	Author(s)
2007	Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finish	Leng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A.
2007	The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish	Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C.

Showing results 11 to 12 of 12 < previous