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Issue Date	Title	Author(s)
2006	TCAD simulation of local mechanical stress reduction by use of a compressive silicon nitride/silicon oxynitride etch stop bi-layer for CMOS performance enhancement	Ahmad, W.R.W. ; Kordesch, A.V. ; Ahmad, I. ; Chew, S.A. ; Yew, P.T.B.
2006	TCAD Simulation of STI stress effect on active length for 130nm technology	Ahmad, W.R.W. ; Kordesch, A.V. ; Ahmad, I. ; Yew, P.T.B.

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