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Issue DateTitleAuthor(s)
2010A study for optimum productivity yield in 0.16μm mixed of wafer fabrication facilityChik, M.A. ; Yung, V.C. ; Balakrishna, P. ; Hashim, U. ; Ahmad, I. ; Mohamad, B. 
2001A study of H2S effect on gold surface using surface plasmon resonance (SPR) measurementsMokhtar, R. ; Hassan, Z.A. ; Yunus, W.M.M. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
2012A study of management corporation financial in high rise residential with correlation of management fund and faculties providedTawil, N.M. ; Md. Yusoff, Y. ; CheAm, A.I. ; Abdullah, N.A.G. ; Surat, M. 
2016A study of meditation effectiveness for virtual reality based stress therapy using eeg measurement and questionnaire approachesPerhakaran, G. ; Yusof, A.M. ; Rusli, M.E. ; Yusoff, M.Z.M. ; Mahalil, I. ; Zainuddin, A.R.R. 
2016A study of meditation effectiveness for virtual reality based stress therapy using eeg measurement and questionnaire approachesPerhakaran, G. ; Yusof, A.M. ; Rusli, M.E. ; Yusoff, M.Z.M. ; Mahalil, I. ; Zainuddin, A.R.R. 
2017A study of mill scale derived hematite process for NiZn ferrite as EMI suppressor in terms of magnetic propertiesHari, Z. ; Alias, M.W.H. ; Anuar, A. ; Hamid, N.A. 
2007A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finishLeng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. 
2014A study of quality of service in the universal DBA algorithm using a PIC-based EPON testbedRadzi, N.A.M. ; Din, N.M. ; Al-Mansoori, M.H. ; Sadon, S.K. ; Majid, M.S.A. 
2014A study of quality of service in the universal DBA algorithm using a PIC-based EPON testbedRadzi, N.A.M. ; Din, N.M. ; Al-Mansoori, M.H. ; Sadon, S.K. ; Majid, M.S.A. 
2008A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder jointLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 
2014A study on effect of PFA on stabilized material using direct shear testShakri, M.S. ; Hafez, M.A. ; Adnan, M.A. 
2009A study on FVSI index as an indicator for Under Voltage Load Shedding (UVLS)Ramasamy, A. ; Verayiah, R. ; Zainal Abidin, H.I. ; Musirin, I. 
2006A study on inter-metallic compound formation and structure of lead free SnAgCu solder systemAhmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R. 
2006A study on lead free SnAgCu solder systemHoh, H.J. ; Eu, P.L. ; Ding, M. ; Ahmad, I. 
2014A study on regression model using response surface methodologyNooraziah, A. ; Tiagrajah, V.J. 
2008A study on static voltage collapse proximity indicatorsVerayiah, R. ; Abidin, I.Z. 
2008A study on static voltage collapse proximity indicatorsVerayiah, R. ; Abidin, I.Z.