1. DSpaceCRIS@UNITEN

Jalar, A.

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Publications
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Date Issued:  [2000 TO 2009]

Results 1-20 of 22 (Search time: 0.0 seconds).

Issue DateTitleAuthor(s)
12006The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) depositionArshad, M.K.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
22004The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) depositionMd Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
32006The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold depositionMd Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Hashim, U. 
42006The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packagingAbdullah, S.H. ; Ahmad, I. ; Jalar, A. 
52007The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finishLeng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. 
62007The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) depositionMd Arshad, M.K. ; Jalar, A. ; Ahmad, I. ; Omar, G. 
72004Some aspects of surface morphology and elemental analysis study on non-wetting problem at die topSalleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Abdullah, S.H. ; Arshad, M.K. 
82006Solder joint strength of lead free solders under multiple reflow and high temperature storage conditionAhmad, I. ; Jalar, A. ; Majlis, B.Y. ; Leng, E.P. ; San, Y.S. 
92007Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finishLeng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A. 
102007Optimization of nickel thickness on substrate for TBGA using SAC387 solder materialAhmad, I. ; Majlis, B.Y. ; Jalar, A. ; Leng, E.P. 
112005Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bumpSalleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
122006Effect of wafer thinning methods towards fracture strength and topography of silicon dieJiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
132008Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)Kornain, Z. ; Amin, N. ; Jalar, A. ; Cheah, A.Y. ; Ahmad, I. 
142006Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strengthEu, P.-L. ; Ahmad, I. ; Jalar, A. ; Kamarudin, H. ; Majlis, B.Y. 
152006Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chippingJiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
162008Dicing laminated wafer for QFN 3D stacked die packagingAbdullah, S. ; Endut, Z. ; Ahmad, I. ; Jalar, A. ; Yusof, S.M. 
172007Dicing die attach film for 3D stacked die QFN packagesAbdullah, S. ; Mohd Yusof, S. ; Ahmad, I. ; Jalar, A. ; Daud, R. 
182007Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold processMd Arshad, M.K. ; Jalar, A. ; Ahmad, I. 
192004Alternative double pass dicing method for thin wafer laminated with die attach filmJiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
202006A study on inter-metallic compound formation and structure of lead free SnAgCu solder systemAhmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R. 

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Jalar, A.
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