Jalar, A.

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2 2010 - 2020
22 2000 - 2009

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24 No Fulltext

Results 21-24 of 24 (Search time: 0.0 seconds).

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	Issue Date	Title	Author(s)
21	2004	Alternative double pass dicing method for thin wafer laminated with die attach film	Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G.
22	2006	A study on inter-metallic compound formation and structure of lead free SnAgCu solder system	Ahmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R.
23	2007	A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish	Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C.
24	2007	A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finish	Leng, E.P. ; Ding, M. ; Ahmad, I. ; Jalar, A.

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Jalar, A.

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