Isnin, A.

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Author: Ahmad, I.

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	Issue Date	Title	Author(s)
1	2011	Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging	Shualdi, W. ; Bais, B. ; Ahmad, I. ; Omar, G. ; Isnin, A.
2	2008	Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging	Shualdi, W. ; Ahmad, I. ; Omar, G. ; Isnin, A.
3	2011	Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates	Muhammad, N.A. ; Bais, B.H. ; Ahmad, I. ; Isnin, A.

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Isnin, A.

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