Omar, G.

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1 2010 - 2020
11 2000 - 2009

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	Issue Date	Title	Author(s)
1	2006	The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition	Arshad, M.K.M. ; Ahmad, I. ; Jalar, A. ; Omar, G.
2	2004	The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) deposition	Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G.
3	2006	The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold deposition	Md Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Hashim, U.
4	2007	The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) deposition	Md Arshad, M.K. ; Jalar, A. ; Ahmad, I. ; Omar, G.
5	2004	Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)	Kornain, Z. ; Ahmad, I. ; Omar, G.
6	2004	Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top	Salleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Abdullah, S.H. ; Arshad, M.K.
7	2011	Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging	Shualdi, W. ; Bais, B. ; Ahmad, I. ; Omar, G. ; Isnin, A.
8	2005	Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump	Salleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G.
9	2008	Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging	Shualdi, W. ; Ahmad, I. ; Omar, G. ; Isnin, A.
10	2006	Effect of wafer thinning methods towards fracture strength and topography of silicon die	Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G.
11	2006	Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping	Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G.
12	2004	Alternative double pass dicing method for thin wafer laminated with die attach film	Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G.

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Omar, G.

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