Seng, F.C.
Publications
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Issue Date | Title | Author(s) | |
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1 | 2013 | Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology | Kar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Seng, F.C. ; Yong, T.C. ; Retnasamy, V. |
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Full Name
Seng, F.C.
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