Endut, Z.

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Author: Endut, Z.

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	Issue Date	Title	Author(s)
1	2006	Solder bump strength and failure mode of low-k flip chip device	Endut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M.
2	2006	Impact of low-k devices on failure mode of flip chip tensile pull test	Endut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M.
3	2006	Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging	Endut, Z. ; Ahmad, I. ; Zaharim, A. ; Sukemi, N.M.
4	2008	Dicing laminated wafer for QFN 3D stacked die packaging	Abdullah, S. ; Endut, Z. ; Ahmad, I. ; Jalar, A. ; Yusof, S.M.

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Endut, Z.

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Universiti Tenaga Nasional Library