Sukemi, N.M.
Publications
(Others)
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Issue Date | Title | Author(s) | |
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1 | 2006 | Solder bump strength and failure mode of low-k flip chip device | Endut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. |
2 | 2006 | Impact of low-k devices on failure mode of flip chip tensile pull test | Endut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. |
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Full Name
Sukemi, N.M.
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